Stellantis and Hon Hai Technological innovation Team, (Foxconn) have signed a non-binding memorandum of knowing to build a partnership to layout a household of intent-crafted semiconductors for the automaker and 3rd-social gathering shoppers.
“Carlos Tavares, Stellantis CEO, claimed: “We intention to build four new families of chips that will deal with more than eighty% of our semiconductor wants, serving to to substantially modernise our components, minimize complexity, and simplify the provide chain. This will also raise our capacity to innovate a lot quicker and construct solutions and expert services at a quick tempo.”
The offer was introduced as aspect of a application working day function wherever the automaker unveiled STLA Mind, the new electrical/electronic and application architecture launching in 2024 across Stellantis’ four battery electrical vehicle platforms – STLA small, medium, massive and body. STLA Mind is entirely OTA capable, building it highly flexible and productive.
“As a top global know-how firm, Foxconn has the depth of experience in production semiconductors and application – two key components in the manufacturing of electrical cars. We seem ahead to sharing this knowledge with Stellantis and with each other deal with the prolonged-expression provide chain shortages, as we go on with the growth into the electrical vehicle marketplace,” claimed Youthful Liu, chairman & CEO of Foxconn Technological innovation Team.
Foxconn has a prolonged history of acquiring semiconductors and applications inside consumer electronics which will extend to the automotive section “with the direction and demand from customers of a world-course mobility partner”.
The semiconductors will also be employed by Foxconn for its personal EVs.
Very last May possibly, the two businesses introduced the Cell Push joint enterprise acquiring smart cockpits.